Assignments

Soldering Kit

No Due Date Max Points: 150
Description:

Assemble and solder together an electronics kit. We will test your kit to see if you properly assembled it. Patience is key!

Integrated circuit exploration!

No Due Date Max Points: 100
Description:

research definitions and take a picture of a real computer chip wafer under the microscope! Find a serial # on the wafer to identify the chip

Exhibition night!

No Due Date Max Points: 100
Description:

present your work to your parents and reflect on your personal growth this semester!

participation/ behavior

No Due Date Max Points: 100

3D print something!

No Due Date Max Points: 150
Description:

Find a 3D model on thingiverse.com and import the model to the anycubic photon slicer software. In the software, add the necessary supports and print the model. Clean the 3D printed model and paint the model with a high level of detail.

attendance

No Due Date Max Points: 50

FOD Competency Quiz

No Due Date Max Points: 10
Description:

FOD stands for Foreign Object Debris and is a common damage prevention method in industry.

Participation/Behavior

No Due Date Max Points: 200

build headphones from scratch!

Nov. 22, 2019 Max Points: 300
Description:

Build headphones from raw materials. This challenging project requires lots of intricate detailed work. These headphones will be on display during exhibition for parents to wear and listen to!

Announcements